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Supermicro Servers with Micron DDR5 & SSDs: Accelerating Real World Workloads
- 1. Confidential
- 2. Confidential Supermicro X13 Comprehensive Portfolio Hyper and Hyper-E Best-in-Class Performance and Flexibility Rackmount Servers for Enterprise Applications Cloud DC All-in-one Rackmount Platforms for Cloud Data Centers Mainstream Versatile Entry Level and Volume Servers for Enterprise Applications BigTwin® Highly Modular Multi-Node Systems with Tool-less Design FatTwin® Advanced Multi-node 4U Twin Architecture with 8 or 4 Nodes Cost-effective 2U Multi-node Platforms TwinPro® SuperBlade® High Density x86 Multi-node Server for Enterprise Cloud, HPC SuperStorage® WIO (UP) Industry’s Widest Variety of I/O Optimized Servers High Density Systems for Double- width, Full Length PCIe GPUs PCIe GPU Servers Universal GPU Servers High Performance and Flexibility with Advanced Architecture and Thermal Design Highest Performance and Flexibility for Enterprise Applications MP 4-Way Server High-efficiency, High-performance Compact Form Factor for 5G and Edge computing IOT/Embedded Top-loading Server Optimized for Field Serviceability and Field Replacement Workstations for High Performance Workloads SuperWorkstations 2 Better Faster Greener™ © 2022 Supermicro GrandTwin® Highly Modular Front Access Multi-Node Systems with Tool- less Design
- 3. Confidential Supermicro Has the Most Genoa Options 2/8/2023 Better Faster Greener™ © 2022 Supermicro 3 AS –2115GT-HNTR (Rear IO) GrandTwin 2U4Node Hyper DP Systems CloudDC UP Systems GPU Systems AS -1015CS-TNR AS -1115CS-TNR AS -2015CS-TNR AS -1125HS-TNR AS -2025HS-TNR AS -2125HS-TNR AS -4125GS-TNRT 8 PCIe 5.0 x16 GPUs AS –2115GT-HNTF (Front IO) Supermicro A+ Product Page https://www.supermicro.com/en/products/aplus
- 4. Confidential 4th Generation Platform Overview (Max per socket) • 3rd Generation Intel Xeon Scalable • Core count: 40 • PCIe lane count: 64 • PCIe Generation: 4th • Memory : DDR4/3200 • 8 channel • 3rd Generation AMD EPYC • Core count: 64 • PCIe lane count: 128 • PCIe Generation: 4th • Memory : DDR4/3200 • 8 channel • 4th Generation Intel Xeon Scalable • Core count : 60 • PCIe lane count: 80 • PCIe Generation: 5th • Memory : DDR5/4800 • 8 channel • 4th Generation AMD EPYC (Genoa) • Core count: 96 • PCIe lane count: 128 • PCIe Generation: 5th • Memory : DDR5/4800 • 12 channel
- 5. Confidential Memory and PCIe Bandwidth 24 x DIMM slots, DDR5 -4800 memory Supports up to 6 TB 32 DIMM slots DDR5 -4800 memory supports up to 8TB Hyper Hyper CloudDC CloudDC 12 DIMM slots, DDR5-4800 Supports up to 3TB 16 DIMM slots DDR5-4800 Supports up to 4TB Up to 160 Lanes of Gen5 PCIe with DP Up to 128 Lanes of Gen5 PCIe with UP H13 X13
- 6. • Micron Confidential • Micron Confidential The CPU/memory challenge 6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 2012 2013 2014 2015 2016 2017 2018 2019 2020 Normalized growth rate CPU core count Memory Channel BW per core Increasing core counts drives memory demand Demanding more bandwidth and capacity Memory is unable to keep up, leading to more DDR channels Year-over-year memory cost per GB reductions flatten Memory capacity scaling challenges are expected to persist
- 7. • Micron Confidential • Micron Confidential Memory bandwidth per core (GB/s) CPU Core Count 24 32 48 64 96 DDR4 has reached its limit! DDR5 increases memory bandwidth per CPU core for next-generation, multi-core CPUs 128 Source: Micron estimates. System bandwidth simulated for x8 modules in 1DPC and dual-channel configuration. DDR5 6400 DDR5 4800 DDR4 3200 DDR5 8800 0 2 4 6 8 10 12 14 40 16 18
- 8. • Micron Confidential • Micron Confidential DDR4 vs DDR5 Up to 3x performance increase Rank(s) left side A Rank(s) left side B 40 bits independent channel A 40 bits independent channel B Data rates (up to 8800 MT/s) 2x burst length (BL16) 2x bank groups (8) 2x banks (32) Improved refresh granularity (same bank refresh) 2 independent 40-bit channels per RDIMM (64 bytes per channel) Micron Simulation, Subject to change Simulated Conditions
- 9. • Micron Confidential • Micron Confidential DDR4 vs DDR5 Simulated effective bandwidth 9 Simulated conditions - BW normalized to x64 interface - 64B random accesses - 66% reads - One dual rank x4 RDIMM DDR4-3200 DDR5-3200 DDR4 3200 vs DDR5 3200 DDR4-3200 DDR5-4800 DDR4 3200 vs DDR5 4800 16.8 GB/s 34.2 GB/s 16.8 GB/s 23.4 GB/s 1.39x 2.03x - 16Gb component addressing - Same bank refresh enabled - Auto-precharge enabled
- 10. • Micron Confidential • Micron Confidential DDR5 data bus efficiency improved Micron Confidential 10 66% efficiency 91% efficiency 89% efficiency DDR4 3200 DDR5 3200 DDR5 4800 DDR4 3200 DDR5 3200 DDR5 4800 16.8 GB/s 25.6 GB/s 23.4 GB/s 25.6 GB/s 34.2 GB/s 38.4 GB/s Simulation Theoretical Theoretical Theoretical Simulated conditions
- 11. • Micron Confidential • Micron Confidential Application workload proof points Micro- benchmark Stream MLC Data center IMDB - REDIS Cloud provider SPEC-jbb SAP-SD SAP-HANA VMmark HPC OpenFoam Cloverleaf CP2K POT3D WRF AI ResNet DLRM BERT
- 12. • Micron Confidential • Micron Confidential Sensitivity of workloads to memory latency, bandwidth and capacity 12
- 13. Confidential The User Perspective - Product Selection • Single Node Systems • Multi-Node Systems • Blade Systems (Networking) • Application Specific Systems
- 15. • Micron Confidential • Micron Confidential Application workload demands in a data-centric world Data center Business applications and real-time services that include large in- memory dB and OLTP Cloud provider Expanded number of users and micro- services that include high-availability, scaling and low latency, virtualized and containerized environments High-performance computing AI/ML and deep learning algorithms with real-time processing and analytics
- 16. • Micron Confidential • Micron Confidential Increased performance for in-memory execution of database and analytics applications 23% 45% 9,756 Query Executions per Hour DDR4-3200 3rd Gen Xeon platorm1 DDR5-4800 4th Gen Xeon platorm2 14,118 Query Executions per Hour SAP HANA 2.0 3 Phase 1 Data Load Time (s) Faster 1.3 billion records loaded More efficient business intelligence for online analytical systems More concurrent operations SAP HANA 2.0 3 Phase 3 0 1 2 3 4 5 6 7 DDR5-4th Gen Xeon platform2 DDR4-3rd Gen Xeon platform1 8 9 10 11 10.49 8.05 Lower is better 1. 3rd Gen Intel Xeon Platinum 8380 processor with Micron DDR4 3200 MHz system 2. 4th Gen Intel Xeon Platinum 8490H processor with Micron DDR5 4800 MHz system 3. SAP Standard Application Benchmark testing the hardware and database performance of SAP applications and components.
- 17. • Micron Confidential • Micron Confidential Speed up your business application workloads Meet Service Level Agreements (SLAs) Improve business agility, scaling and efficiency SPECjbb max-jOPS 3 1.40x 224,892 jOPS DDR4-32001 DDR5-4800 2 315,663 jOPS 1.48x 135,269 jOPS DDR4-32001 DDR5-48002 200,288 jOPS SPECjbb critical-jOPS 3 1. 3rd Gen Intel Xeon Platinum 8380 processor with Micron DDR4 3200 MHz system 2. 4th Gen Intel Xeon Platinum 8480 processor with Micron DDR5 4800 MHz system 3. SPECjbb is registered trademark of Standard Performance Evaluation Corporation. Performance results are derived from detailed benchmark procedures available at http://www.spec.org Increased transactional throughput Reduced latency and response times Better Quality of Service (QoS)
- 18. • Micron Confidential • Micron Confidential Improve HPC efficiency Reduce overall runtime of HPC simulations Increase design iterations to improve accuracy Faster time-to-market 20 The memory bandwidth required for next-generation HPC servers >3x HPC workload performance boost 2.96 3.16 2.56 3.24 2.60 Speed factor for HPC workloads 1. AMD DDR4 system is an AMD EPYC 7763 64 core with DDR4-3200 MHz fully populated with 64GB RDIMMs 2. AMD DDR5 system is an AMD EPYC 9654 96 core with DDR5-4800 MHz fully populated with 64GB RDIMMs
- 19. • Micron Confidential • Micron Confidential DDR5 for data- intensive workloads 2xcapability 2x burst length 2x bank groups 2x banks 2x or higher bandwidth1 Increased bandwidth More than 2x1 Higher bus efficiency Greater than 80%1 Faster transfer speed Up to 8800 MT/s2 Improving overall workload performance3 Cloud Data center High-performance computing 22 34.2 GB/s 16.8 GB/s 23.4 GB/s 2.03x 1.39x DDR4-3200 DDR5-4800 DDR5-3200 DDR4 3200 DDR5 4800 Virtualization 40% HPC modeling >200% Business apps 45% 1. Benchmark simulation comparison of DDR5-4800 vs DDR4 -3200 2. Based on defined JEDEC specification 3. Results based on internal testing, 3rd party testing and/or industry workload benchmark testing
- 20. • Micron Confidential • Micron Confidential
- 21. © 2023 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners. 24 Thank you!
Editor's Notes
- X13 Intel -Optimized, Open Architectures More than 15 server categories -Resourcing saving architecture to reduce material and energy usage -Enhanced thermal capacity – supporting next-gen CPUs, GPUs and other components Flexible networking with Advanced I/O Modules (AIOM), up to 400G/s speeds High ambient temperature operations up to 40C with liquid cooling options Support for open and industry standards including OCP 3.0, OAM, ORV2, OSF, Open BMC and EDSFF
- H13 AMD (Genoa) 4 Family/categories utilizing SMCI innovative system designs