This document provides an overview of Intel Corporation in 2014. It discusses Intel's mission to bring smart, connected devices to everyone using Moore's Law. Over 75% of Intel's business is outside the US, with key focus areas including data center, client, ultra-mobile, and wearables/IoT. Intel has a track record of executing Moore's Law and developing new process technologies like 14nm. The document outlines Intel's various business groups and labs focusing on areas like the internet of things. It provides a roadmap for Intel gateways for IoT and discusses Intel's history and position as the world's largest semiconductor manufacturer.
The document describes the Dell Latitude 5000 Series laptops. Key features include thinner and lighter designs, longer battery life enabled by Intel 4th Generation Core processors, optional touchscreens, and reliable and durable construction. The laptops also offer strong security features like encryption and authentication options. They are designed to be manageable with tools that integrate with Microsoft System Center and Dell KACE for easy deployment and maintenance of large fleets.
Extreme Manufacturing Solutions
Operations Performance Analytics (OPA)
Business alignment - Over time, the proliferation of devices has created unnecessary complexity. Control Center delivers centralized visibility and granular control of network resources. One click can equal a thousand actions when you manage your network. Control Center can even manage beyond Extreme Networks switching, routing, and wireless hardware to deliver standards-based control of other vendors’ network equipment.
Pairing assets with intelligent sensors to gather, analyze, and communicate data is driving enormous new efficiencies in manufacturing and business operations. Just as in the consumer markets, where the first generation of personal fitness monitors and smart home devices leverage data sets to influence and shape events in the physical world, so too are operational efficiencies borne by the Internet of Things (IoT) generating high returns in manufacturing.
According to McKinsey, “business-to-business applications will account for nearly 70 percent of the value … from IoT in the next ten years.” The firm estimates that of the nearly $11 trillion a year in economic value generated globally, ‘nearly $5 trillion [will] be generated almost exclusively in B2B settings, including factories… such as those in manufacturing, agriculture, and even healthcare environments; work sites across mining, oil and gas, and construction; and, finally, offices.’
More informed decision-making and optimized operations across the extended supply chain are only some of the benefits. Wireless sensors, whether measuring hydrogen levels in the soil or temperature variables on the production line, are eliminating blind spots in traditional manufacturing processes and delivering a constant flow of data that optimize workflows. And while manufacturers have leveraged data in discrete applications for Manufacturing Execution Systems (MES) and Enterprise Manufacturing Intelligence (EMI) systems for years, the growth of sensors, real-time dashboards, cloud-applications, and mobile technologies are delivering new degrees of actionable intelligence to the precise location at the precise time it can be optimally leveraged.
Yet this goal of seamlessly moving data across plant and business functions, and applying analytical tools to enable new insights, requires a new degree of visibility into the performance of manufacturing applications, networks, and systems. Traditionally monitoring tools used in factory environments are often isolated, closed, proprietary, and offer only a keyhole view of IT system performance.
Industrial IoT with Intel IoT Gateway & OctobluIntel® Software
This document discusses Intel and Octoblu's partnership to enable industrial IoT solutions. It describes Intel's IoT gateway platform and Octoblu's IoT cloud platform. Together, their platforms provide a full-stack solution for connecting devices, routing data, running automation workflows, and providing security and management tools. The document also notes the large market opportunity for industrial IoT and provides an overview of how customers can deploy the joint solution either on-premises or via various cloud options.
The document provides an overview of embedded system design, including application areas like automotive, industrial, and consumer electronics. It discusses the embedded system development cycle and factors to consider when choosing a microcontroller, such as features, communication interfaces, on-chip peripherals, and vendor support. Microcontrollers are selected based on technical requirements as well as familiarity, price, and available development tools and kits.
This document provides an overview of networking concepts covered in Chapter 6 of the IT Essentials 5.0 course. It defines key networking terms like LANs, WANs, protocols, topologies and physical components. The chapter objectives are outlined and each section defines and describes networking concepts such as IP addressing, DHCP, switches, routers and common cabling types.
The document discusses Edge computing and the Akraino Edge Stack project. It provides an overview of the Linux Foundation Edge (LF Edge) organization and its goals of establishing an open source framework for edge computing. It then summarizes the Akraino Edge Stack project, which aims to address telco, enterprise, and industrial IoT use cases through the creation of tested and validated deployment-ready blueprints for edge cloud configurations. It outlines several blueprints that were released in Akraino R1 and previews new blueprints and enhancements planned for the future.
This chapter discusses the Cisco IOS operating system and how to perform basic configurations on Cisco networking devices. It covers accessing and navigating the Cisco IOS command-line interface, setting hostnames, securing device access with passwords, saving configurations, and configuring IP addresses and testing connectivity. The key topics are accessing the Cisco IOS through its command-line interface, learning IOS navigation modes, and making initial device configurations including hostnames, passwords, and IP addresses.
Cellnetrix is a company committed to developing secure software products and services for wireless mobility and internet usage. It implements client-server solutions for mobile networks and provides professional services to mobile operators and other clients. Key products include CellSIM operating system for smart cards, CellOTA over-the-air management services, and CellApps value-added applications. Cellnetrix also offers software development, testing, and technical consulting services.
ELCE 2010 - State Of Multimedia In 2010 Embedded Linux DevicesBenjamin Zores
The document provides an overview of multimedia capabilities and options for embedded Linux devices in 2010. It discusses hardware selection factors for different ARM and MIPS SoCs. It also examines the state of 2D, 3D and video support, including both software and hardware implementations. Finally, it considers underlying operating system choices and application frameworks for developing software on embedded devices.
This document discusses the components and features of laptop computers. It describes how laptops have a compact size due to integrating the keyboard, screen, and internal components into a portable case. It provides details on the common external components of laptops such as ports, slots, indicators and covers internal components such as the CPU, memory and wireless antennas. It also compares laptop components to desktop components and describes how laptops can connect to networks through technologies like Bluetooth, infrared, cellular networks and WiFi.
This document provides an overview of personal computer components and certifications for IT technicians. It describes the CompTIA A+ and EUCIP IT Administrator certifications and their focus areas. The basic components of a personal computer are explained, including the computer case, power supply, motherboard, CPU, memory, storage, ports, cables, cooling systems, and input/output devices. Characteristics of each component are defined, along with considerations for component selection and compatibility.
Slide deck for talk at IETF#92 (Dallas, March 2015) at the IETF Light-Weight Implementation Guidance (lwig) working group about the performance of cryptographic algorithms on ARM processors.
Intel was founded in 1968 and is the world's leading semiconductor chip maker. It has over 100,000 employees and annual revenue of $55.9 billion. Intel invests heavily in research and development, spending $11.5 billion per year. This significant investment allows Intel to continuously develop new manufacturing processes and chip technologies years ahead of competitors. While Intel dominates the PC and server chip markets, it faces challenges breaking into the mobile and tablet sectors currently led by ARM processors. Intel is working to reduce losses in mobile and gain market share in servers.
Your Path to Edge Computing - Akraino Edge Stack UpdateLiz Warner
The Akraino community was proud to announce the availability of its release 1 on June 6th. The community has experienced extremely rapid growth over the past year, in terms of both membership and community activity. Before Akraino, developers had to download multiple open source software packages and integrate/test on deployable hardware, which prolonged innovation and increased cost. The Akraino community came up with a brilliant way to solve this integration challenge with the Blueprint model. An Akraino Blueprint is not just a diagram; it’s real code that brings everything together so users can download and deploy the edge stack in their own environment to address a specific edge use case. Learn more about the Akraino Edge Stack. In this talk, we will share details about R1 blueprints and their use, R2 goals, and how to engage and contribute to the Akraino Community.
Như vậy là sau những hình ảnh leak ra từ Lenovo thì họ đã chính thức giới thiệu dòng laptop doanh nhân cao cấp của mình - Thinkpad X1 Carbon Gen 9. Tìm hiểu chi tiết về mẫu laptop này trước khi quyết định ngay nhé.
Nguồn: https://laptops.vn/san-pham/lenovo-thinkpad-x1-gen-9/
This document summarizes a presentation on the ISO 26262 approval of automotive software components. The presentation discusses ISO 26262 objectives for software, key characteristics of reusable software components, and the integration of qualified software components. It notes that ISO 26262 qualification of software components is possible if components have certain characteristics like modularity and provide documentation like a compliance matrix to guide integrators.
The document discusses the responsibilities and skills required of IT professionals. It covers the importance of communication skills in troubleshooting, as well as ethics, legal issues, and how to handle difficult customers. It also describes call center environments and the roles of level 1 and 2 technicians. Key points are that technical expertise must be paired with strong communication, and IT professionals must maintain high ethical and professional standards.
SAP HANA Distinguished Engineer (HDE) Webinar: Overview of SAP HANA On-Premis...Tomas Krojzl
This slide deck was used to present public webinar "SAP HANA On-Premise Deployment Options" - additional information including replay information can be found here: http://scn.sap.com/community/hana-in-memory/blog/2016/05/25/sap-hana-distinguished-engineer-hde-webinar-overview-of-sap-hana-on-premise-deployment-options
The document discusses SAP HANA Tailored Datacenter Integration (TDI) as the mainstream option for on-premise SAP HANA deployments. It notes that SAP HANA was initially only available as an appliance, which created financial and operational challenges for organizations. However, TDI now offers more choices for deploying HANA, and more customers are choosing the flexible and cost-effective TDI model. TDI allows organizations to leverage existing hardware, tools, and IT processes for their SAP HANA environment, aligning it with standard datacenter architectures and reducing costs, risk, and complexity compared to the appliance model.
MT12 - SAP solutions from Dell – from your Datacenter to the CloudDell EMC World
SAP HANA has accelerated the pace of innovation – an in-memory platform that runs analytics applications smarter, business processes faster, and data infrastructures simpler. Join this session to learn how Dell EMC offers the broadest solutions for SAP HANA for any sized customer with the best performance and the most customer choices- from on-premise to hybrid to cloud.
This document discusses SAP HANA system replication which can be automated using the SUSE High Availability Solution. It provides an overview of SAP HANA scenarios for high availability and disaster recovery. It also summarizes the steps to install and configure SAP HANA system replication using the SUSE clustering and automation tools. New use cases that will be supported in upcoming versions are also presented such as single-tier replication with additional non-production systems and multi-tier cascading replication configurations.
Tackling Retail Technology Management Challenges at the EdgeRebekah Rodriguez
As the adoption of intelligent applications in the Retail industry grows, so do their technology requirements. This creates challenges for store operators to navigate the deployment and maintenance of hardware, applications, and management tools at locations without a dedicated IT staff. Along with the complexity of solutions, these operators are dealing with a wide range of installation scenarios, specific to the products or services they offer.
Purpose-built edge systems, such as Supermicro’s Fanless servers powered by Intel® Xeon D® processors, provide a secure and rugged platform that can be deployed where conventional servers cannot. These systems, along with our broad portfolio of short-depth rackmount systems, can be combined with the Reliant Platform by Acumera, a secure, cost-effective, and central cloud managed solution to automate delivery and management of applications, networking, and security controls either in-store or in the cloud.
Join this webinar to hear how these solutions are currently employed across thousands of locations, simplifying Edge IT for many major retailers today. Speakers will include David Nielsen, Sr. System Product Manager for IoT and Edge Applications, Richard Newman and Brett Stewart, Technology Leaders at Acumera, as well as Craig Carter, Product Line Manager from Intel to discuss the latest generation of the Xeon D platform.
The number of internet-connected devices is growing exponentially, enabling an increasing number of edge applications in environments such as smart cities, retail, and industry 4.0. These intelligent solutions often require processing large amounts of data, running models to enable image recognition, predictive analytics, autonomous systems, and more. Increasing system workloads and data processing capacity at the edge is essential to minimize latency, improve responsiveness, and reduce network traffic back to data centers. Purpose-built systems such as Supermicro’s short-depth, multi-node SuperEdge, powered by 3rd Gen Intel® Xeon® Scalable processors, increase compute and I/O density at the edge and enable businesses to further accelerate innovation.
Join this webinar to discover new insights in edge-to-cloud infrastructures and learn how Supermicro SuperEdge multi-node solutions leverage data center scale, performance, and efficiency for 5G, IoT, and Edge applications.
Introduction to the new MediaTek LinkIt™ Development Platform for RTOSMediaTek Labs
The new MediaTek LinkIt™ Development Platform for RTOS is based on ARM Cortex-M4 MCU architecture and provides leading features for the creation of connected appliances, home and office automation devices, smart gadgets, and IoT bridges. Supporting a range of chipsets (initially the MediaTek MT7687F), LinkIt for RTOS offers the convenience of a single toolset and common API implemented over a popular RTOS. With this you can achieve economies across a full range of consumer and business IoT devices. The platform consists of a Software Development Kit (SDK), Hardware Development Kits (HDKs), including modules from supply chain partners, and related technical documentation. The first release of the platform supports the MediaTek MT7687F Wi-Fi SOC which has a 192 MHz MCU, 1×1 802.11b/g/n Wi-Fi subsystem, integrated security engine (AES and 3DES/SHA), embedded SRAM/ROM and 2MB flash. The new platform uses FreeRTOS with open-source modules for TCP/IP, SSL/TLS, HTTP (client and server), SNTP, DHCP daemon, MQTT, XML and JSON. Development and debugging is supported by free command line tools, plus a KEIL plug-in.
Ti k2 e for mission critical applicationsHitesh Jani
The document discusses the TI-K2E for mission critical applications. It introduces the Keystone II family of processors, specifically the 66AK2Ex and AM5K2Ex variants. These variants provide powerful ARM and DSP cores, high performance at low power, security and reliability features. Example application areas discussed include aerospace, medical, and industrial automation. Specific use cases in areas like medical robotics and industrial imaging are also described.
This session will describe and demo methods to connect the Intel Edison to Amazon AWS in order to create a versatile IoT structure. The Intel Edison is a powerful system on chip module, the size of a postage stamp with powerful on board processing. It can be used as a sensor hub to gather data, a control board for actuators, and a gateway to connect to the cloud. When combined with the powerful services offered by AWS it can form the basis for many IoT solutions.
AWS DevDay San Francisco, June 21, 2016.
Presenter: Martin Kronberg, Intel oT Evengelist
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2020/11/smarter-manufacturing-with-intels-deep-learning-based-machine-vision-a-presentation-from-intel/
For more information about edge AI and computer vision, please visit:
https://www.edge-ai-vision.com
Tara K. Thimmanaik, Solutions Architect at Intel, presents the “Smarter Manufacturing with Intel’s Deep Learning-Based Machine Vision” tutorial at the September 2020 Embedded Vision Summit.
As demand for smarter and more efficient manufacturing is growing, IoT technologies—including sensors, edge devices, gateways, servers and the cloud—are being used throughout the factory to compute deep learning analytics workloads at the appropriate location. Efficient data-driven manufacturing can help to reduce labor costs, increase quality and maximize profit. The biggest hindrance to achieving these outcomes is the difficulty in extracting data from vendor-locked and proprietary systems for analytics downstream.
In this presentation, Thimmanaik covers Intel’s approach to developing open, flexible and scalable solutions, including:
• Intel’s technologies such as OpenVINO, Movidius Vision Processor Units, Edge Insights Software (EIS) and deep learning algorithms
• How Intel’s offerings come together in the industrial marketplace with partnerships forged to address the constraints of manufacturing infrastructure
• Real-world examples highlighting defect detection in textile printing (where 90% accuracy at 50 fps was achieved) and smartphone screen production (where false negatives were only 0.6%)
The document discusses Cisco's Field Area Network solution including:
- Multi-service connectivity using smart endpoints, fog computing, security, management, and standards
- The DevNet and Solution Partner Program focusing on technology, partner stories, and participation levels
- Cisco's approach to enabling IoT applications including open standards, security, management, and providing application capabilities at the network edge
A session in the DevNet Zone at Cisco Live, Berlin. Flare allows users with mobile devices to discover and interact with things in an environment. It combines multiple location technologies, such as iBeacon and CMX, with a realtime communications architecture to enable new kinds of user interactions. This session will introduce the Flare REST and Socket.IO API, server, client libraries and sample code, and introduce you to the resources available on DevNet and GitHub. Come visit us in the DevNet zone for a hands-on demonstration.
Intel® Ethernet Series Delivering Real-World Value. As computing and networking scale in performance, interconnect technologies play a critical role in ensuring systems reach their full potential in the speed at which they move data. Intel has been at the forefront of research and development into interconnect technologies since the dawn of the PC era. Today in the data center, Intel is working to deliver greater levels of intelligence within its connectivity solutions to overcome network bottlenecks and accelerate applications. Between PC and peripherals, Intel is heavily involved with the industry as it brings the latest technologies to market for the best user experiences. At the chip level, Intel is leading the industry in advanced packaging with technologies that connect chiplets and modules in order to deliver Moore’s Law advances, while also working to reduce latency between memory and CPU. From “Microns to Miles,” Intel’s investments in interconnect technologies are among the broadest in the industry.
Noile soluţii Intel pentru afaceri eficiente-20apr2010Agora Group
This document discusses Intel technologies for efficient IT infrastructures and provides the following key points:
1. Intel has fabrication facilities around the world producing microchips on advanced technology nodes.
2. Intel's Core processor family delivers scalable performance across devices from netbooks to servers through Intel architecture.
3. Intel's new 2010 Core processor family features improved performance and energy efficiency through technologies like Turbo Boost.
Noile tehnologii INTEL pentru infrastructuri IT eficiente-19mar2010Agora Group
This document discusses Intel technologies for efficient IT infrastructures and provides the following key points:
1. Intel has fabrication facilities around the world producing microchips on advanced technology nodes.
2. Intel's Core processor family delivers scalable performance across devices from netbooks to servers through Intel architecture.
3. Intel's new 2010 Core processors feature technologies like Turbo Boost for intelligent performance and integrated graphics.
Noile solutii Intel pentru afaceri eficiente-tm-20mai2010Agora Group
This document discusses Intel technologies for efficient IT infrastructures and provides the following key points:
1. Intel has fabrication facilities around the world producing microchips on advanced technology nodes.
2. Intel's Core processor family delivers scalable performance across devices from netbooks to servers through Intel architecture.
3. Intel's new 2010 Core processors feature technologies like Turbo Boost for intelligent performance and integrated graphics.
Noile soluţii Intel pentru afaceri eficiente-23apr2010Agora Group
This document discusses Intel technologies for efficient IT infrastructures and provides the following key points:
1. Intel has fabrication facilities around the world producing microchips on advanced technology nodes.
2. Intel's Core processor family delivers scalable performance across devices from netbooks to servers through Intel architecture.
3. Intel's new 2010 Core processors feature technologies like Turbo Boost for intelligent performance and integrated graphics.
This resume summarizes Pratik Panchal's experience as an embedded engineer. He has over 4 years of experience working with C and C++ on projects involving digital signage, energy meters, networking gateways, and vending machines. His roles have included application development, firmware programming, and functionality testing on platforms such as Linux, Windows, and microcontrollers from Texas Instruments and Microchip. He is seeking a position where he can apply his programming skills and experience developing embedded systems.
Red Hat® Ceph Storage and Network Solutions for Software Defined InfrastructureIntel® Software
This document discusses Intel's vision for software defined infrastructure (SDI) and provides examples of how their technology enables SDI. The key points are:
1. Intel's SDI vision is to provide dynamic, policy-driven management of compute, storage, and networking resources through abstraction, orchestration, and standards-based solutions.
2. Red Hat Ceph Storage is presented as an open source, scalable storage solution optimized for SDI through the use of commodity servers and SSDs.
3. Intel is contributing to open standards and growing an ecosystem of partners through their Network Builders program to accelerate the SDI transformation.
The MRAA and UPM Eclipse IoT Projects | Eclipse IoT Day Santa Clara 2019Eclipse IoT
With Internet of Things (IoT) platforms, sensors and actuators becoming more performant, smaller, and cheaper, new opportunities emerge for diverse applications in multiple domains such as smart homes and cities, industrial automation, healthcare and retail, environment and agriculture, transportation and safety, digital surveillance and security, control systems and robotics, wireless sensor networks, and many others. The IoT community is more vibrant than ever but with the incredible device diversity in this space, we also introduce a lot of complexity for the software developer. During recent years, Intel® established itself as a leader in IoT by releasing proven developer kits and software tools with select partners for a broad range of developer personas and skill levels. This presentation focuses primarily on the MRAA and UPM middleware projects which have been a part of the Intel IoT Developer Kits since day 1 and are now proudly joining the Eclipse IoT community. The MRAA library provides an abstraction layer for several Intel and non-Intel IoT platforms, offering C/C++, Java, JavaScript, and Python bindings to the physical pins and buses. This is subsequently used by the UPM sensor library for exposing standardized APIs intended to simplify the interaction between developers and peripherals, with virtually over 400 different specialized sensors, actuators and radio modules currently supported as part of the project.
//SPEAKER
Tudor Panu, Intel
[OpenStack Day in Korea 2015] Keynote 2 - Leveraging OpenStack to Realize the...OpenStack Korea Community
OpenStack Day in Korea 2015 - Keynote 2
Leveraging OpenStack to Realize the SKT Software-Defined Data Center
Jinsung Choi, Ph.D - CTO, Corporate R&D Center, SK Telecom
This document discusses considerations for building cross-platform applications. It notes that businesses must choose between device or platform strategies given the unpredictable nature of technology. A future-proof solution is ideal. Market trends show workers using multiple devices and expecting great experiences. Cross-platform development is challenging due to hardware and software fragmentation, while native, web, and hybrid approaches each have pros and cons. The best approach depends on a company's unique tasks and strategy for building single-purpose or hub applications.
The document discusses Getac rugged computers, outlining their history of innovation in rugged hardware since 1989, their global presence, key technologies around materials, displays and certifications, and product lines including fully rugged tablets, notebooks and mobile servers designed for demanding work environments.
This document provides information on Embedded Building Block Server Solutions from Supermicro. It includes:
- Descriptions of several motherboard and server solutions targeting applications such as communications infrastructure, industrial automation, digital content management, and more.
- Details on low-power Intel Atom and Intel Xeon processor-based servers in 1U and 2U rackmount form factors with features like IPMI, redundant power supplies, and PCIe expansion.
- Embedded building block server solutions optimized for workloads in areas like networking, security, medical imaging, and cloud/cold storage applications.
- Atom and Xeon processor motherboard options with features for communications, security, and supporting multiple independent displays.
This document summarizes A+ Server's new generation of server building block solutions based on AMD Opteron 6000/4000/3000 series processors. It highlights several key products including the 2U Twin2 server chassis that can hold up to 128 cores and various high-performance server motherboards like the H8DG6-F that supports up to 512GB of RAM and 6 PCIe slots. The document also briefly describes the features and use cases of these products.
This document provides information on SuperBlade's blade server solutions, including specifications for different blade models that support various Intel Xeon processors and GPU/Xeon Phi expansion options. Key details include the ability to house up to 40 CPUs or 20 CPUs plus 30 GPU cards in a single 7U enclosure, using up to 6 enclosures per standard 42U rack for maximum density. Management features and energy efficiency are also highlighted.
Blue line Supermicro Server Building Block SolutionsBlue Line
This document provides information on Supermicro's next generation serverboard and embedded solutions using Intel's Ivy Bridge and Haswell architectures. It summarizes various serverboards, chassis, and embedded boards that provide improved performance up to 40%, lower power consumption, support for the latest Intel Xeon E5-2600 v2 processors with up to 12 cores, SAS 3.0 (12Gbps), PCI-E 3.0, and up to 1.5TB of DDR3 memory. Options include datacenter optimized, mainstream, workstation, and embedded form factors.
This document summarizes several server products from Supermicro, including:
- The FatTwin server which can support up to 12 GPU/Xeon Phi cards in a 4U chassis and provides high performance computing capabilities.
- The TwinPro2 server which provides a 2U twin server solution with SAS 3.0 and up to 1TB of memory across two nodes.
- The MicroCloud server which offers 24, 12, or 8 modular server nodes in a compact 3U chassis, saving rack space for cloud computing and web hosting applications.
- The GPU/Xeon Phi server which can support up to 8 GPUs or Xeon Phi cards in a 4U chassis for high performance computing
Blue Line A/S is an ISO 9001:2008 certified company with over 25 years of experience and 20 employees. They provide solutions in three business areas: 1) industrial computers and displays, 2) rugged mobile computers, and 3) digital signage. Blue Line uses a project model approach and offers maximum reliability through testing and customization. Their products are used across industries like marine, healthcare, production, and more. Digital signage can improve branding, sales, and the customer experience.
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5. Hi-K Metal Gate
Strained Silicon
3D Transistors
65 nm 45 nm 32 nm 22 nm 14 nm 10 nm 7 nm90 nm
Enabling new devices with higher
functionality and complexity while
controlling power, cost, and size
5
Predictable Silicon Track Record
Executing to
Moore’s Law
6. Leading Edge Process Technology
* Forecast
Transistor Performance/ Generation
32nm45nm
1x
0.1x
0.01x
0.001x
65nm 22nm
LowerTransistorLeakage
Higher Transistor Performance (Switching Speed)
14nm*
Mobile Always-on Circuits
Client Computing
Mobile Computing
Server Computing
6
7. Network
Storage
Software
Servers
Enterprise IT Cloud Service
Providers
Communication
Service Providers
Technical
Computing
Data Center Group
Defining and leading an open data center,
cloud computing, and connected systems
infrastructure that will connect and enrich
the lives of every person on earth through
seamless and pervasive computing.
7
8. PC Client Group
Win the Hearts of Users by Creating and Bringing to Market
the Next Generation of Personal Computing Experiences
8
9. Powering the next generation of tablets, smartphones, feature
phones and communication solutions
Mobile and Communications Group
* Other names and brands may be claimed as the property of others.
9
10. New Devices Group
10
Deliver groundbreaking new device technologies and platforms that inspire
and create the best human interaction to our virtual and physical worlds
Smart Devices Platforms for Creators
11. Internet of Things Group
11
Lead the industry in transforming businesses and the way we live by making
it simple to create exciting, new IoT solutions
GATEWAY
NETWORK
INFRASTRUCTURE
DATA CENTER/ CLOUD
THINGS
7
YEARS
SILICON, SOFTWARE AND SECURITY
SCALABILITY
Devices that connect to the Internet
integrating greater compute capabilities
using data analytics to extract information
THE INTERNET OF
THINGS:
12. Cloud API Services
Client Software Platforms
Intel Software & Services Group
SSG enhances computing and connectivity for Intel Architecture across the
software ecosystem and through our software products and services.
Network
Infrastructure
12
Cloud and Data Center Products
Intel Developer Zone
* Other names and brands may be claimed as the property of others.
13. Deliver breakthrough
innovations to fuel
Intel’s growth and
technology leadership
INTEL LABS
COLLABORATE FOR RESULTS
UNIVERSITIES GOVERNMENTS INDUSTRY
KEY RESEARCH FOCUS AREAS
USER
EXPERIENCE
ARCHITECTURE
AND DESIGN
SYSTEMS AND
SOFTWARE
SECURITY AND
PRIVACY
INTEGRATED
COMPUTING
STRATEGY,
PLANNING and
COLLABORATION
INTEL LABS EUROPE
Sustainable
Intelligent Systems
INTEL LABS CHINA
China Tech
Ecosystem
ADDITIONAL ORGANIZATIONS
13
14. Making and managing financially attractive investments
in support of Intel’s strategic objectives
STRATEGIC FINANCIAL
Intel Capital
1,339 Companies • US $11B+ Invested
55 Countries • 344 M&A Transactions • 206 IPOs
1414
Capital
15. Intel® Education
Empowering Youth. Transforming Communities.
150M Students Learning with Technology
10M Teachers Empowered with Professional Development
7M Students in Affiliated Science Competitions
4M Employee Volunteer Hours for Education
$100M Annual Investment
to Improve Education in
100 Countries
15
26. Configurable TDP / Low Power Mode (cTDP/LPM)
26
- Starting from Haswell (Broadwell & Skylake also enabled)
- Not for battery saving – it’s about thermals
- Also affects Turbo modes
- LPM does processor off-lining or enables minimum
frequency (depends on workload)
28. Wearables, start with Edison
Intel
Expansion Boards
Partner
Expansion Boards
Built to Order
Expansion Boards
https://www.sparkfun.com/categories/272
29. Intel Quark (Galileo)
29
- Processor UnCore
- DDR3 memory controller
- Up to 2GB @ 800MTs
- ECC-On-Chip Option
- Embedded 512KB SRAM
- Legacy Block
- PC compatible IO, APICs,RTC, etc.
- 20MHz Legacy SPI for boot code
- Low cost 5-pin JTAG Port
- Industry Standard I/O Hardware
- 2 - x1 PCIe Gen 2*
- 2 - 10/100Mb Ethernet MACs
- 2 - USB2 host ports (EHCI, OHCI)
- 2 - HS UART controller
- 2 – 25MHz SPI ports for peripherals
- 1 – USB2 HS Device port
- 1 - SD/SDIO/eMMC interface
- 1 – I2C/GPIO Host controller
- 16 - GPIOs w prog interrupts
- Industry Standard Software Support
- Standard Compiler Support
- Pentium ISA Compatibility (.586)
- Runs unmodified Linux Kernels (v3.8+)
- Yocto based distribution
- Validated w WR IDP 2.0 (Linux & VxWorks)
- Open Source UEFI EDK II
- GRUB boot loader support
- Open OCD Debugging support
- Compliant with PCIe, USB, ACPI standards
- Thermals
- TDP = 1.9W Extended temp (-40 to +85 C)
- TDP = 2.2W Commercial Temp: 0 – 70°C
- Programmable Thermal sensor
- Electricals:
- Single xtal for internal/external clocks
- Enabled Single std external VR solution
- Physical
- Package size 15x15mm
- 393 Pin, FC BGA bare die
- 0.593 Ball Pitch
- Enables FR4 SFF Board
- Security
- Secure Boot Technology Option
- Supervisory Mode Execution Protection
- Secure Recovery for UEFI FW
- Secure Remote Upgrade w/ WR IDP 2.0
- Intel® Quark™ Processor Core
- Single Quark CPU Core, Single Thread
- 32 bit, x86, @ 400MHz
- 16KB L1
- 1.25 DMIPs/MHz
42. Production MI Gateways are
ready for the end customer!
6
OEM gives image to
ODM to load onto GW’s.
42
From Development to Production: MI Gateway
2
WRS creates BSP
3
Intel qualifies HW
design & BSP
1
ODM selects
design based on
MI spec
4*
OEM buys a
production DK
(from Intel or ODM) to
build image & get
distribution rights
5*
OEM gets IDP
release w/support of
target ODM HW &
builds image
ODM creates BSP
OR
4* Qualifications: SK100 is needed by ODM if they want to produce their own dev kit. DK50 is NOT production ready. Must use DK100, DK200 or qualified ODM dev kit.
5* Note: the “Binary” image includes OS, middleware & OEM-specific value-add app all in one single image.
7
ODM purchases MI-
specific SoC (w/ rights to
distribute image)
8
ODM builds MI GWs
and loads image on
them
43. Competitive Analysis Key Results
Key Findings:
• Moon Island positioned well in all five categories
vs. competition
• Crowded industry with solutions ranging in
features and price
• Low end offerings <$100 with basic encryption
to pass through data
• High end offerings with router like functionality
>$1000
Key Moon Island Differentiators:
• Comprehensive security features
• IA stability & scalability
• Development environment with open platform
43
*Other names and brands may be claimed as the property of others.
44. 44
v2.0
(Shipping now)
v2.1
(2014)
Targeted 3.0+ Features
(2015+)
Ecosystem and
3rd Party Support
Development Tools
Data Storage
Analytics
Predictive Maintenance
EMS-IBM
Energy
Services
Eurotech
End Point Device
Manageability
AT&T
Security
and
Manageability
White Listing
Read/Write Control
Web interface
OMA-DM, TR-069
UEFI Secure Boot
Cloud-based manageability
Pre-loaded and
Validated Wind River
EMS agent
EMS and McAfee (MEC)
White List
Read/Write Control
Enhanced Security
Device Attestation
Deep Packet Inspection
UX
Getting Started Guides Quick Start Guides Include out-of-box usages with Dev Kits
Protocols
MQTT, SSH, ZigBee, etc. Same as v2.0 Expanded communication: CDMA + LTE
Wireless Hart, 6LoWPan, EnOcean
HW / OS
Wind River Linux 32bit
Wind River IDP
Intel® Quark SoC
Intel® Atom™ Processor
eMMC Support Intel® Core Processor
Virtualization (legacy app support)
Wind River OS
64bit Support (Atom, Core)
VXworks RTOS
Intel® Gateways for IoT Roadmap
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice *Other names and brands may be claimed as the property of others.
45. Connectivity
DevelopmentEnvironment
Intel BSP: Board and Modules (Intel® Quark™ SoC, Intel® Atom™ SoC)
Linux* 5.0.1
Ecosystem
Apps &
Services
SI/ITOs,
Customers
Manageability Security
Cloud
Connector
OMA DM
TR-069
Web Config
OpenSSL* Library
SRM Signing Tool
Certificate Management
Secure Boot
Application Integrity Monitor
Application Resource Control
Secure Package
Management
Encrypted Storage
McAfee* Embedded
Control
Intel Gateways Solutions for IoT Software
Third Party
2G/3G/4G
Bluetooth*
Ethernet
Zigbee*† Stack
Serial / USB
VPN
WiFi Access Point
MQTT
Lua*
Java*
OSGi*
McAfee*
Embedded
Control
Runtime
Environment
45
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
*Other names and brands may be claimed as the property of others.
†Enabled by third party hardware,
46. History of Intel
Back in 1968, two scientists, Robert Noyce and Gordon Moore, founded
Intel with a vision for semiconductor memory products.
By 1971, they had introduced the world’s first microprocessor. Since
then, Intel has established a heritage of innovation that continues to
expand the reach and promise of computing while advancing the ways
people work and live worldwide.
46
47. Intel Corporation
The World’s Largest Semiconductor Manufacturer
• Leading Manufacturer of Computer, Networking & Communications Products
• Founded by Gordon Moore and Robert Noyce in 1968
• Headquartered in Santa Clara, California
• $52.7B in Annual Revenues - 25+ Consecutive Years of Positive Net Income
• 170 Sites in 66 Countries
• Over 107,000 Employees – 84,600 technical roles, 10,200 Masters in Science,
5,400 PhDs, 4,000 MBAs
• Named one of the Top Ten Most Valuable Brands in the World by Interbrand
• Ranked #42 on Fortune’s World’s Most Admired Companies
• Largest Voluntary Purchaser of Green Power in the United States for 6 years in a row
• Invests $100 Million Each Year in Education Across More than 100 Countries
• 4 Million Hours of Volunteer Service toward improving education over the past decade
47
48. Intel’s Advantage
Packaging
Software
Intel Architecture Product Design
Manufacturing
Co-Optimized Process & Product
Co-Optimized Architecture & Software
Best Performance, Power, Security
Rapid Product Ramp
Process Technology
Common
TOOLS
Common
GOALS
48
49. Fab and Assembly / Test Sites
IrelandOregon
Arizona
New Mexico
Massachusetts
Costa Rica
Chengdu
Vietnam
Penang
Kulim
Dalian
Israel
Wafer Fabs
Assembly/Test
49
51. World’s First Conflict-Free Microprocessors1
51
TANTALUMTUNGSTEN
TIN GOLD
1 Intel has manufactured the world’s first commercially available “conflict-free” processors. “Conflict-free” means “DRC conflict-free”, which is defined by the Securities and Exchange Commission rules to mean
products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.
What are Conflict Minerals?
Conflict Minerals are metals that come
from the Democratic Republic of Congo
(DRC), a place where violent militias and
rebel groups control trade, exploit workers,
and finance violence.
What has Intel done?
Intel, along with partners, created an
audit and verification system that
supports responsible sourcing of
minerals from the DRC and the
pursuit of conflict-free supply chains.
52. Innovation for the Planet
Energy Efficient Computing
Next billion PCs and servers will consume HALF the
energy and deliver 17X the compute capacity
(2007-2014) Source: Intel
Eco Technology Innovation
Technology innovation is fundamental to finding
solutions to the world’s environmental challenges
Pursuing a Gentler Footprint
Largest voluntary purchaser of “green” power in the U.S.
for 6 years in a row*
*According to EPA Green Power Program ratings
52